中科院微電子所副研究高可靠功率系統(tǒng)集成的發(fā)展和挑戰(zhàn)Development and Challenge of High-Reliability Power System in Packaging侯峰澤中國(guó)科學(xué)院微電子研究所系統(tǒng)封裝與集成研發(fā)中心副研究員Fengze HOUAssociate Professor、 Packaging and Integration Research and Development Center, Institute of Microelectronics of Chinese Academy of Sciences
72000
